| Sanghua Microelectronics
(Shanghai) Co., Ltd. was founded in April 2000. It is a
private held, venture capital invested Fabless semiconductor
company. The company is headquartered in Shanghai Zhang
Jiang Hi-Tech Park occupying over 1400 square meter (12,500
square feet) office space.
Ours designs and develops high-performance integrated circuits
for the Digital Multimedia market place. Our DSC Business
Unit offers high-performance solutions for Digital Still
Camera, USB 2.0 PC Web Camera and USB 2.0 TV tuner/ Video
capture peripherals. Our mission is to optimize our technologies
to provide a single chip controller and cost effective system
design solution for our customers.
Application Specified Standard Product (ASSP)
The company was the first IC design house established in
Far East. It has many core technologies, such as Embedded
CPU, Embedded DSP, Embedded ROM, Embedded Flash / EPROM,
Embedded SRAM and Mix Mode Block, available in 8-bit, 16-bit,
24-bit and 32-bit. The applications of ASSP include Microcontroller,
LCD Controller, Speech & Audio Controller, Monitor Controller,
MP3 Decoder, DSC Controller and other 3C industrial products.
Each product series uses "Single Chip" as the
"Target Solution".
DSP Standard Product
DSP standard products are available in 16-bit, 24-bit and
32-bit for all system applications.
Application Software Design for ASSP & DSP
Products
Provides application software design for ASSP and DSP standard
products. It will help users to get familiar with every
product from the company and, consequently, achieve the
target of system integration.
Application Specified IC Design (ASIC Design)
The standard cell ASIC design service provided will help
users to achieve the targets of product size reduction,
energy saving, low costs, production simplification and
increased market competitiveness.
System On Chip Back End Service
The combination of the company powerful high-level Back
End tools and equipment and the strategy alliance relationship
with many wafer OEM and IC packaging plants worldwide can
provide sectional or full turn-key service in IC layout,
wafer production and testing and IC packaging. |